1年级数学用圆片摆两位数

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      Second Annual NEPP Conference on Electronic Parts, Packaging, and Radiation Characterization for Space Applications in conjunction with IMAPS' SoCal '01 Symposium and Exhibition - Summary


      The Second Annual NEPP Conference on Electronic Parts, Packaging, and Radiation Characterization for Space Applications in conjunction with IMAPS' SoCal '01 Symposium and Exhibition (15-16 May 2001, Pasadena, California) included about 60 talks on a variety of topics. There were several papers that I found of interest relative to ETE, which are (very briefly) summarized below. Overall, my impression is that NASA is expanding its interest and activity in ETE both low and high. This is in response to the needs of current and upcoming missions—as pointed out in a Keynote Presentation by Richard Brace of JPL/Caltech, NASA needs to infuse new technology in order carry out its missions; however, the technology also must be sufficiently mature to represent an acceptable risk.

      "Packaging Reliability of High Temperature SiC Devices" L.-Y. Chen (see below, substituting for the listed speaker, S.-T. Lin of United Technologies Research Center) described analysis of SiC die attach using a thick-film material and the effect of materials and parameters on reliability for applications to the 500°C range.

      "Packaging Technology for 500°C SiC Microsystems" L.-Y. Chen of NASA Glenn Research Center (co-authors G. W. Hunter and P. G. Neudeck) overviewed NASA activities on packaging for the 500°C range and results of experimental evaluation of thick-film materials, wire bonding, and die attachment.

      "Recent Advances in Low Temperature Electronics for Space" R. L. Patterson of NASA Glenn Research Center (co-authors J. E. Dickman, E. Overton, S. Gerbeer and M. Elbuluk) explained NASA's interest in low-temperature electronics for missions to cold environments, the drawbacks of heating the electronics, and the appeal of reducing or eliminating thermal management. He then summarized their investigations of components and circuits for cryogenic operation.

      "JPL's Experience with Extreme Cold Temperature Parts Evaluation" M. Sandor of JPL/Caltech (co-author S. Agarwal) described characterization of electronic parts outside their specified temperature ranges and qualification of parts for space projects involving low-temperature environments.

      "Development and Application of High Temperature Sensors and Electronics" G. W. Hunter of NASA Glenn Research Center described development of sensors of various types and interconnections for high temperature applications.

      "R&D of High Power Density and High Temperature Package Techniques" T. Lin of IJ Research, Inc (co-author R. Yoon) spoke on materials and technology for AlN packaging for high temperatures.

      "Performance of Rad-Hard Quad Receivers at Extreme Temperatures" Q. Kim of JPL/Caltech (co-authors S. Agarwal and D. Vu) presented a case study with data on the performance and reliability of a line receiver down to −125°C for possible application in Mars exploration.

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      Adapted from "Extreme-Temperature Electronics Newsletter", Issue #2, 26 June 2001

      Copyright © 2001-2003 by Randall K. Kirschman.

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